UG305P tai wan semiconductor 1 version:a1702 3 a, 300 v ultrafast recovery rectifier features very low profile , typical height of 1.1mm glass passivated junction chip excellent high temperature stability ultrafast recovery time for high efficiency compliant to rohs d irective 2011/65/eu and in accordance to weee 2002/96/ec halogen - free according to iec 61249 - 2 - 21 applications lighting application switching mode power supply (smps) adapters on - board dc/dc converter mechanical data case: to - 277a (smpc) molding compound meets ul 94v - 0 f lammability rating moisture sensitivity level: level 1, per j - std - 020 packing code with suffix "g" means green compound (halogen - free) terminal: matte tin plated leads, solderable per j - std - 002 meet jesd 201 class 1a whisker test polarity: as marked weight: 0.095g (approximately) key parameters p arameter value unit i f(av) 3 a v rrm 300 v i fsm 50 a t j max 150 c package to - 277a(smpc) configuration single die to - 277a (smpc) absolute m aximum ratings ( t a = 25 c unless otherwise noted ) p arameter s ymbol UG305P unit marking code on the device UG305P r epetitive peak reverse voltage v rrm 300 v r everse voltage, total rms value v r( r m s ) 210 v f orward current i f(av) 3 a surge p eak forward current, 8.3 ms single half sine - wave superimposed on rated load per diode i fsm 50 a junction t emperature t j - 50 to +150 c storage temperature t stg - 50 to +150 c
UG305P tai wan semiconductor 2 version:a1702 thermal performance p arameter s ymbol l imit unit junction - to - l ead t hermal r esistance r ? j l 14 c /w junction - to - a mbient thermal r esistance r ? j a 60 c /w junction - to - c ase thermal r esistance r ? j c 1 6 c /w thermal performance note : units mounted on recommended pcb ( 16mm x 16mm cu pad test board ) electrical specifications ( t a = 25 c unless otherwise noted ) parameter conditions symbol t yp m ax u nit forward voltage per diode (1) i f = 1.5a, t j = 25 c v f 0.8 6 1.00 v i f = 3a, t j = 25 c 0.93 1.10 v i f = 1.5a, t j = 125 c 0.70 0.82 v i f = 3a, t j = 125 c 0.79 0.92 v reverse current @ rated v r per diode (2) t j = 25 c i r - 10 a t j = 125 c - 250 a junction capacitance 1 mhz, v r =4.0v c j 47 - p f reverse recovery time i f =0.5a , i r =1.0a i rr =0.25a t rr - 2 5 ns notes: 1. pulse test with pw=0.3 ms 2. pulse test with pw= 30 ms ordering information part no. packing code packing code suffix package packing UG305P (note 1) s1 g smpc 1,500/ 7" plastic reel s2 smpc 6,000/ 13" plastic reel note : 1. whole series with green compound (halogen - free) example example p/n part no. packing code packing code suffix description UG305P s1g UG305P s1 g green compound
UG305P tai wan semiconductor 3 version:a1702 characteristics curves (t a = 25c unless otherwise noted) fig . 1 forward current derating curve fig . 2 typical junction capacitance fig . 3 typical reverse characteristics fig . 4 typical forward characteristics 0 1.5 3 4.5 25 50 75 100 125 150 lead temperature ( c) resistive or inductive load with heat sink 1 10 100 1 10 100 reverse voltage (v) f=1.0mhz vsig=50mvp - p 0.0010 0.0100 0.1000 1.0000 10.0000 100.0000 10 20 30 40 50 60 70 80 90 100 t j =25 c t j =125 c 0.1 1 10 100 0.40 0.60 0.80 1.00 1.20 1.40 1.60 pulse width 300s 1% duty cycle t j =25 c t j =125 c capacitance (pf) instantaneous reverse current ( a) percent of rated peak reverse voltage (%) instantaneous forward current (a) (a) 0.001 0.01 0.1 1 10 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 pulse width t j =25 c t j =125 c uf1dlw forward voltage (v) average forward current (a)
UG305P tai wan semiconductor 4 version:a1702 package outline dimensions suggested pad layout marking diagram dim. unit (mm) unit (inch) min max min max a 5.650 5.750 0.222 0.226 b 6.350 6.650 0.250 0.262 c 4.550 4.650 0.179 0.183 d 3.540 3.840 0.139 0.151 e 4.235 4.535 0.167 0.179 f 1.850 2.150 0.073 0.085 g 3.170 3.470 0.125 0.137 h 1.043 1.343 0.041 0.053 i 1.000 1.300 0.039 0.051 j 1.930 2.230 0.076 0.088 k 0.175 0.325 0.007 0.013 l 1.000 1.200 0.039 0.047 symbol unit (mm) unit (inch) a 4.80 0.189 b 4.72 0.186 c 1.40 0.055 d 1.27 0.050 e 6.80 0.268 f 1.04 0.041 p/n = marking code yw = date code f = factory code
UG305P tai wan semiconductor 5 version:a1702 notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, to any intellectual property rights is granted by this document. except as provided in tscs terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life - saving, or life - sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale.
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